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机床用途与性能特征
1、机床为单、多晶硅切断专用机床；
2、机床具有高速、高效、低损耗的特点；
3、机床工作台进给由直线导轨+滚珠丝杠+伺服电机控制，进给速度任意可调；
4、优质金刚石锯带确保高效率，小锯缝，高成品率；
5、锯带由油缸自动张紧，张紧力任意可调，稳定可靠；
6、新锯带夹持机构能确保锯带工作时不发生剧烈抖动；数控单晶硅切断机配备单晶硅切断专用夹具；
7、配有空气除尘装置接口；
8、电气系统采用进口三菱Q系列CPU。
Main features of the machine
1、This machine is specially designed for Monocrystalline polycrystalline silicon bar sawing process.
2、Machine Features high process speed & efficiency and high rate of final products.
3、The machine is path driven by the servo motor through the linear guideway and ball screw, the selective loading and feeding speed.
4、High quality diamond band saw is adopted, which features high sawing & cutting efficiency small kerf and high rate of final products.
5、The band saw tension is controlled by the oil cylinder, its tension force can be randomly adjusted thus the possibility of band saw crack is effectively reduced.
6、The latest design of saw band retain,avoid the strenuous whipping.Monocrystalline silicon bar sawing process
Specially-design gripper for monocrystalline bar.
7、The air dedusting device adopted.
8、MITSUBISHI seies Q CPU adopted. |
加工多晶硅参数
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| 带锯电机功率 Band saw motor |
7.5Kw |
| 带锯转速 band saw rotation speed |
1500转/分 |
| 带锯带速 Band saw speed |
1300m/min |
| 工作台尺寸 Processing table dimension |
820X1050mm |
| 喉深 Throat depth |
900mm |
| 带锯张紧 Band saw tension |
500Kg～2000Kg(任意可调 selective) |
| 带轮尺寸 Band saw wheel dimension |
Φ915mm |
| 工作台行程 Processing table travel |
350mm |
| 快进速度 Feeding speed |
300mm/min |
| 进给速度 Processing Speed |
10～80mm/min |
| 带锯规格（长×宽×高）Band saw diemsion |
6100×38×1.0 mm |
| 机床重量 Machine Net wight |
3，500kg |
| 机床外形尺寸 Machine Dimension（长×宽×高） |
2258×1267×2840mm |
| 机床总功率 Machine total power |
10Kw |
| 设备加工凸凹误差 Convex-concave error |
±0.2mm |
| 设备加工效率 Convex-concave error |
10分钟/块(切两刀,硅块尺寸156×156) |
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10min/piece (1 cuts, 156*156 inch silicon bar) |
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加工单晶硅参数
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| 带锯电机功率 Band saw motor |
7.5Kw |
| 带锯转速 band saw rotation speed |
1500转/分 |
| 带锯带速 Band saw speed |
1300m/min |
| 工作台尺寸 Processing table dimension |
820X1050mm |
| 喉深 Throat depth |
900mm |
| 带锯张紧 Band saw tension |
500Kg～2000Kg(任意可调 selective) |
| 带轮尺寸 Band saw wheel dimension |
Φ915mm |
| 工作台行程 Processing table travel |
350mm |
| 快进速度 Feeding speed |
300mm/min |
| 进给速度 Processing Speed |
10～80mm/min |
| 带锯规格（长×宽×高）Band saw diemsion |
6100×38×1.0 mm |
| 机床重量 Machine Net wight |
3，500kg |
| 机床外形尺寸 Machine Dimension（长×宽×高） |
2258×1267×2840mm |
| 机床总功率 Machine total power |
10Kw |
| 设备加工凸凹误差 Convex-concave error |
±0.2mm |
| 设备加工效率 Convex-concave error |
6寸硅棒为4.5分钟一刀；8寸为6分钟一刀 |
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6″silicon bar 4.5mins each cut ; 8″silicon bar 6mins each cut |
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1、销售总监1名：
大专以上学历，在太阳能行业或相近机械行业销售管理工作经验，具有大中型企业2年以上销售经理或相同职位工作经验；...
2、销售主管3名：
大学专科以上学历，市场营销、机械类专业；从事机械销售1年以上，熟悉太阳能硅片加工设备或机械设备市场开发；..... |
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